Raw data of Fig. 4D from Copper/carbon nanotube composites: research trends and outlook

We present research progress made in developing copper/carbon nanotube composites (Cu/CNT) to fulfil a growing demand for lighter copper substitutes with superior electrical, thermal and mechanical performances. Lighter alternatives to heavy copper electrical and data wiring are needed in automobiles and aircrafts to enhance fuel efficiencies. In electronics, better interconnects and thermal management components than copper with higher current- and heat-stabilities are required to enable device miniaturization with increased functionality. Our literature survey encouragingly indicates that Cu/CNT performances (electrical, thermal and mechanical) reported so far rival that of Cu, proving the material's viability as a Cu alternative. We identify two grand challenges to be solved for Cu/CNT to replace copper in real-life applications. The first grand challenge is to fabricate Cu/CNT with overall performances exceeding that of copper. To address this challenge, we propose research directions to fabricate Cu/CNT closer to ideal composites theoretically predicted to surpass Cu performances (i.e. those containing uniformly distributed Cu and individually aligned CNTs with beneficial CNT–Cu interactions). The second grand challenge is to industrialize and transfer Cu/CNT from lab bench to real-life use. Toward this, we identify and propose strategies to address market-dependent issues for niche/mainstream applications. The current best Cu/CNT performances already qualify for application in niche electronic device markets as high-end interconnects. However, mainstream Cu/CNT application as copper replacements in conventional electronics and in electrical/data wires are long-term goals, needing inexpensive mass-production by methods aligned with existing industrial practices. Mainstream electronics require cheap CNT template-making and electrodeposition procedures, while data/electrical cables require manufacture protocols based on co-electrodeposition or melt-processing. We note (with examples) that initiatives devoted to Cu/CNT manufacturing for both types of mainstream applications are underway. With sustained research on Cu/CNT and accelerating its real-life application, we expect the successful evolution of highly functional, efficient, and sustainable next-generation electrical and electronics systems.

本研究汇报了铜/碳纳米管复合材料（copper/carbon nanotube composites, Cu/CNT）的开发进展，以满足市场对轻量化铜替代材料日益增长的需求——这类材料需兼具优异的电学、热学与力学性能。为提升汽车与航空器的燃油效率，行业亟需替代重型铜质电气与数据布线的轻量化材料。在电子领域，为实现功能提升的同时推进器件小型化，亟需性能优于铜、兼具更高电流稳定性与热稳定性的新型互连结构与热管理组件。我们开展的文献调研结果令人振奋：目前已报道的Cu/CNT复合材料的电学、热学与力学性能已可与纯铜媲美，证明该材料作为铜替代材料具备可行性。我们明确了Cu/CNT材料在实际应用中替代纯铜需攻克的两项重大挑战。第一项挑战为制备综合性能超越纯铜的Cu/CNT复合材料。针对该挑战，我们提出了制备方向：即制备更接近理论预测的高性能理想复合材料——这类材料需实现铜与碳纳米管均匀分散、碳纳米管定向排列，且碳纳米管与铜基体间存在有益的界面相互作用，以使其性能超越纯铜。第二项挑战是实现Cu/CNT材料的产业化，将其从实验室阶段推向实际应用。为此，我们针对细分/主流应用场景中的市场依赖型问题，提出了相应的解决策略。目前最优的Cu/CNT复合材料已具备作为高端互连结构应用于细分电子设备市场的资质。然而，将Cu/CNT作为铜替代材料应用于常规电子设备与电气/数据布线属于长期目标，需通过契合现有工业流程的工艺实现低成本大规模生产。主流电子设备应用需采用低成本的碳纳米管模板制备与电沉积工艺，而数据/电力电缆则需基于共电沉积或熔融加工的制造方案。我们举例指出，针对上述两类主流应用场景的Cu/CNT制造研发计划已在推进中。随着对Cu/CNT复合材料研究的持续推进，以及其实际应用的加速落地，我们预计具备高功能、高效率与可持续性的下一代电气与电子系统将迎来成功发展。