Analysis of Ball Soldering Parameters on the Properties of a BGA Packaged Semiconductor

Integrated circuits have several applications, including medicine and the aerospace industry, where reliability is essential. Packaging is an important step in the manufacturing of integrated circuits, and ball soldering is one of the most critical process, especially in assembling and interconnecting integrated circuits. The solder joint formed during the ball soldering process is intrinsically associated with the performance and the reliability of the electronic system. This study analyzed the influence of parameters or factors affecting the ball soldering process from the perspective of intermetallic compound formation and shear stress of the solder joint. The results indicate there is an interaction coupling between these two factors that cannot be seen when they are investigated individually, meaning that the individual effect of each factor differs from that of the combinations of factors. The results showed that the factor that most influenced shear stress and thickness of the intermetallic compound was peak temperature during ball soldering.

集成电路（Integrated Circuits）在医药及航空航天等对可靠性要求极高的领域拥有广泛应用。封装是集成电路制造流程中的重要环节，而焊球钎焊（Ball Soldering）是其中最为关键的工艺之一，尤其适用于集成电路的组装与互连工序。焊球钎焊过程中形成的焊点（Solder Joint），其质量本质上直接关联电子系统的整体性能与可靠性。本研究从金属间化合物（Intermetallic Compound）生成规律与焊点剪切应力（Shear Stress）两个视角，分析了影响焊球钎焊工艺的各类参数与因素。研究结果显示，两类影响因素间存在耦合交互效应：当单独对单一因素开展研究时，无法观测到该效应，即各因素的单独作用效果与其组合应用时的作用效果存在显著差异。结果表明，对剪切应力与金属间化合物厚度影响最为显著的因素为焊球钎焊过程中的峰值温度。