Data underlying the PhD dissertation 'Low-temperature nanoparticles sintering technology in heterogeneous integration'

The following dataset corresponds to the source of the plots and SEM images used in the PhD dissertation titled "Low-temperature nanoparticles sintering technology in heterogeneous integration".<br>In this dissertation, investigation at the atomic level on microstructure evolution, mechanical, and anti-corrosion performance was conducted by employing the atomistic simulation. The revealed relationship between microstructure and performance can boost material and process optimization. In the experiments, thermal and mechanical properties at the microscale and macroscale on the low-temperature sintered structure were characterized, where an Anand model was proposed. This information improved the understanding of failure mechanisms under certain loading, which reduced the barrier to applying the technology in different use cases. Beyond the zero-hour performance, the online thermal impedance monitoring methodology is implemented on the sintered joint to better understand the performance degradation. Consequently, power device packaging and hermetic packaging applications are achieved, indicating low-temperature sintering technology as a reliable and versatile technology in heterogeneous integration.

本数据集对应于题为《异质集成中的低温纳米颗粒烧结技术》的博士学位论文中所用绘图与扫描电子显微镜（SEM，Scanning Electron Microscope）图像的来源。
该论文通过原子模拟技术，从原子尺度对微观结构演化、力学性能及抗腐蚀性能展开了系统研究。所揭示的微观结构与性能间的内在关联，可为材料研发与工艺优化提供关键指导。
实验环节中，研究团队对低温烧结结构的微尺度与宏尺度热学、力学性能开展了表征工作，并提出了Anand模型。该研究成果深化了对特定载荷条件下失效机制的认知，降低了该技术在不同应用场景中推广落地的技术壁垒。
除初始性能外，研究团队还在烧结接头中引入了在线热阻抗监测方法，以进一步探究性能退化的内在规律。
最终，该技术成功应用于功率器件封装与气密封装领域，证实低温烧结技术是一种可靠且通用的异质集成工艺方案。