"Reverse design of the MIM-enhanced EBG structure"

"This dataset is part of a study on the optimization of electromagnetic bandgap (EBG) structures for system-in-package (SiP) applications. It focuses on the integration of Metal-Insulator-Metal (MIM) capacitors into the EBG unit cell, to suppress electromagnetic interference (EMI) over a wider frequency band. The dataset includes parameterized designs with 6 variables and their corresponding performance metrics such as stopband frequency and bandwidth."

本数据集属于一项面向系统级封装（system-in-package, SiP）应用的电磁带隙（electromagnetic bandgap, EBG）结构优化研究的组成部分。该数据集聚焦于将金属-绝缘体-金属（Metal-Insulator-Metal, MIM）电容集成至EBG单元胞中，以实现更宽频段内的电磁干扰（electromagnetic interference, EMI）抑制。本数据集包含6个变量的参数化设计方案，以及其对应的性能指标，如阻带频率与带宽。