Calibration Data for Wafer 2 of SRM 3461 - MEMS Cantilever Stiffness

These are the unprocessed electron back scatter diffraction patterns (EBSPs) collected from the mesas of electron beam induced deposition (EBID) material, in addition to the Mathematica notebook used to process the images. Each of the 12 EBID mesa has 10 EBSPs collected at 20 kV and 10 kV, in addition to several longer line scans that step from the silicon substrate onto the EBID mesa.

本数据集包含从电子束诱导沉积（electron beam induced deposition，EBID）材料台面结构采集得到的未处理电子背散射衍射花样（electron back scatter diffraction patterns，EBSP），以及用于处理此类图像的Mathematica笔记本文件。12个EBID台面结构中的每一个，均采集了10组分别在20 kV与10 kV加速电压下的EBSP；此外还采集了多条从硅衬底步进至EBID台面结构的长距离线扫描数据。