Semiconductor Industrial Lands Loan Program (SILL)
收藏Oregon Open Data Portal2025-09-17 更新2026-03-28 收录
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https://data.oregon.gov/d/nht7-kaxe
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The Semiconductor Industrial Lands Loan (SILL) Program's purpose is to accelerate investment in planning and improving industrial lands to support investment in semiconductor manufacturing uses and increase the state’s inventory of project-ready industrial sites for semiconductor manufacturing industry investments.
SILL is a forgivable loan program designed to reimburse government entities, property owners and businesses, up to $2.5 million for development projects, and planning activities of at least $100,000 for sites of 10 acres or more. Development projects can include a range of eligible activities such as land acquisition, infrastructure and utility improvements, and environmental remediation or mitigation of industrial properties for semiconductor manufacturing uses.
This dataset lists recipients for Fiscal Year 2025, the first year of programmatic data. For more information, please visit:
https://www.oregon.gov/biz/programs/SILL/Pages/default.aspx
半导体工业用地贷款（Semiconductor Industrial Lands Loan, SILL）计划的宗旨在于加快工业用地规划与升级改造的投资步伐，为半导体制造业相关投资提供支撑，并提升本州可供半导体制造业投资使用的项目就绪型工业用地储备规模。
SILL是一项可豁免贷款项目，旨在为政府机构、物业所有者及企业提供费用报销服务：针对面积不低于10英亩的地块，可报销最高250万美元的开发项目费用，以及至少10万美元的规划活动费用。开发项目可涵盖多项合规活动，包括土地收购、基础设施与公用设施升级改造，以及适配半导体制造业用途的工业用地环境修复与污染缓解工作。
本数据集收录了该计划首个财年——2025财年的受助方名单。如需获取更多信息，请访问：
https://www.oregon.gov/biz/programs/SILL/Pages/default.aspx
提供机构：
data.oregon.gov
