An obsolescence management framework for a defense industry company

This article proposes how the obsolescence processes of electronic components can be managed as a main process by integrating them into other main processes for large-scale defense industry companies. The focus of this study is the sub-processes of the four main processes related to the management of the defense company's electronic components: project management, research and development, production and services, and supply chain management. A new overarching obsolescence management process integrated into these four main processes have been designed, specifically tailored for a large-scale defense industry company, using a process map example drawn in Microsoft Visio (Appendix A and B). The details of which inputs, outputs, and document packages from the subprocesses of these main processes will be used in the design of the new obsolescence management process are provided in detail in the process maps in the appendices. Original process map of this study including workflows created using Microsoft Visio modeling notation in the appendices are available at Mendeley Data, V1, doi: 10.17632/4xxvrkf2tc.1. Appendices A and B provide process map of the product development and obsolescence management workflow between the four main processes in a defense industry company. In this process map, it can be traced which inputs and outputs of the four main processes and subprocesses related to obsolescence management, containing data for electronic components, will be utilized. The process map is presented as workflows created using Microsoft Visio modeling notation in the appendices is also available at Mendeley Data, V1, doi: 10.17632/4xxvrkf2tc.1.
The analysis of the current workflow between the four main processes can be found in the first 4 columns of Appendix A. The rightmost column depicts the newly established obsolescence management process and subprocesses designed as a main process for the company, aligned with these four main processes, along with the inputs and outputs of these subprocesses. An example of the application of the shell structure model is depicted as a process map design in the appendices, illustrating the processes of a defense industry company.
On the x-coordinate of the figure in Appendices A and B, these four main processes and subprocesses are represented. The x-coordinate analyses these four main processes on the vertical separation. The three design phases are presented on the y-coordinate: concept design, preliminary design, and critical design. The three design phases are used to understand how electronic components progress within the company's existing workflows and transform into Bill of Materials (BOM) lists to be transferred to the production process. These three design phases are selected as milestones in designing the process map in the appendices. The points at which electronic components are included in the product lifecycle can be traced from these phases.

本文提出，针对大型国防工业企业，可将电子元器件过时管理流程整合至其他核心流程中，使其成为一项独立的核心管理流程。本研究聚焦于与国防企业电子元器件管理相关的四大核心流程的子流程，分别为项目管理、研发、生产与服务以及供应链管理。
本研究针对大型国防工业企业，设计了一套整合至上述四大核心流程的全新综合过时管理流程，并借助微软Visio（Microsoft Visio）绘制的流程示意图示例（附录A与附录B）进行说明。附录中的流程示意图详细阐述了来自上述四大核心流程的子流程的输入、输出与文档包将如何应用于全新过时管理流程的设计。本研究的原始流程示意图（含附录中采用Visio建模符号创建的工作流）可在Mendeley Data V1版本中获取，数字对象标识符（DOI）：10.17632/4xxvrkf2tc.1。
附录A与附录B展示了国防企业四大核心流程之间的产品研发与过时管理工作流流程示意图。通过该示意图可追溯与过时管理相关的四大核心流程及其子流程的哪些输入、输出（含电子元器件数据）将被利用。附录中采用Visio建模符号创建的工作流形式的流程示意图，同样可在Mendeley Data V1版本中获取，DOI：10.17632/4xxvrkf2tc.1。
四大核心流程间当前工作流的分析可参见附录A的前四列。最右侧一列展示了为该企业设计的、适配四大核心流程的全新过时管理流程与子流程，同时列出了这些子流程的输入与输出。附录中还以流程示意图设计的形式展示了壳结构模型的应用示例，用以说明国防工业企业的相关运营流程。
在附录A与附录B的图表中，x轴代表上述四大核心流程及其子流程，并通过纵向分隔对四大核心流程进行分析。y轴则标注了三大设计阶段：概念设计、初步设计与详细设计。这三大设计阶段用于阐明电子元器件如何在企业现有工作流中演进，并转化为物料清单（Bill of Materials, BOM）以传递至生产流程。本研究将这三大设计阶段选为附录中流程示意图设计的里程碑节点，通过这些节点可追溯电子元器件纳入产品生命周期的具体时点。