Supplementary Information Files for ' Multi-material additive manufacturing of low sintering temperature Bi2Mo2O9 ceramics with Ag floating electrodes by selective laser burnout'

Supplementary Information Files for ' Multi-material additive manufacturing of low sintering temperature Bi2Mo2O9 ceramics with Ag floating electrodes by selective laser burnout'<br>Abstract:Additive manufacturing (AM) of co-fired low temperature ceramics offers a unique route for fabrication of novel 3D radio frequency (RF) and microwave communication components, embedded electronics and sensors. This paper describes the first-ever direct 3D printing of low temperature co-fired ceramics/floating electrode 3D structures. Slurry-based AM and selective laser burnout (SLB) were used to fabricate bulk dielectric, Bi2Mo2O9 (BMO, sintering temperature = 620–650°C, εr = 38) with silver (Ag) internal floating electrodes. A printable BMO slurry was developed and the SLB optimised to improve edge definition and burn out the binder without damaging the ceramic. The SLB increased the green strength needed for shape retention, produced crack-free parts and prevented Ag leaching into the ceramic during co-firing. The green parts were sintered after SLB in a conventional furnace at 645°C for 4 h and achieved 94.5% density, compressive strength of 4097 MPa, a relative permittivity (εr) of 33.8 and a loss tangent (tan δ) of 0.0004 (8 GHz) for BMO. The feasibility of using SLB followed by a post-printing sintering step to create BMO/Ag 3D structures was thus demonstrated.<br>

《基于选择性激光脱粘（Selective Laser Burnout，SLB）制备带银（Silver，Ag）悬浮电极的低烧结温度Bi₂Mo₂O₉陶瓷多材料增材制造》补充信息文件<br>摘要：共烧低温陶瓷的增材制造（Additive Manufacturing，AM）为新型三维射频（Radio Frequency，RF）与微波通信组件、嵌入式电子器件及传感器的制备提供了独特路径。本研究首次实现了低温共烧陶瓷/悬浮电极三维结构的直接3D打印。采用基于浆料的增材制造技术与选择性激光脱粘（SLB），制备了带有银内部悬浮电极的块体介质Bi₂Mo₂O₉（简称BMO，烧结温度为620~650℃，相对介电常数εr=38）。研究开发了可打印BMO浆料，并对SLB工艺进行优化，以提升边缘清晰度，在不损伤陶瓷基体的前提下脱除粘结剂。SLB工艺提升了生坯成型所需的生坯强度，制备出无裂纹构件，并避免了共烧过程中银元素向陶瓷基体的浸析。经SLB处理后的生坯在常规炉中于645℃烧结4小时，所得BMO构件致密度达94.5%，抗压强度为4097 MPa，相对介电常数（εr）为33.8，8 GHz下的损耗正切（tan δ）为0.0004。本研究证实了采用SLB工艺结合打印后烧结步骤制备BMO/Ag三维结构的可行性。