Test Structures for the Characterisation of Sensor Packaging Technology

This dataset corresponds to a conference paper which presents three test structures targeted at characterising sensor packaging materials for liquid environments. The test structures enable the evaluation of: 1) the successful removal of packaging material on sensing areas, 2) the permeability of the packaging material to its environment, 3) electrical continuity through the packaging process, and 4) the ingress of the liquid environment between the packaging material and the chip surface. The paper presents an example of the evaluation of a UV curable resin as packaging process for a biomedical sensor.

本数据集对应一篇会议论文，该论文提出了三种用于表征液体环境中传感器封装材料的测试结构。该类测试结构可实现以下四项评估内容：1）传感区域封装材料的有效去除；2）封装材料对其所处环境的渗透性；3）封装工艺过程中的电气连续性；4）液体环境在封装材料与芯片表面之间的侵入情况。该论文还给出了以紫外固化树脂（UV curable resin）作为生物医学传感器封装工艺的评估实例。