Impact of Interconnection Failure on Photovoltaic Module Performance

This data set consists of illuminated and dark current-voltage (I-V), suns-Voc, and EL images for a set of modules used in an interconnection study. Four 60-cell, multicrystalline Al-BSF modules were systematically cut from the rear side to inflict interconnection failures, resembling solder bond failures in the field. The cutting procedure is described in experiment PowerPoint.<br>Illuminated I-V, suns-Voc, and the summary_IV_performance spreadsheet were obtained from the Sinton FMT-350 tool.<br>The EL images in this set are taken as "EL sweeps," in which for each set of images, a series of individual images using increasing bias currents are obtained. This is used for calibrated EL image analysis to extract dark I-V from each cell using the module level images. Images were obtained using an 8MP cooled Si CCD camera with an 850nm longpass filter.

本数据集包含用于互连性研究的一组光伏组件的光照与暗态电流-电压（I-V）、suns-Voc以及电致发光（Electroluminescence, EL）图像。研究人员对4块60晶胞多晶铝背场（Aluminium Back Surface Field, Al-BSF）组件的背面进行系统性切割，以引入互连失效，模拟实际户外场景中的焊键失效问题。切割流程详见实验演示PPT文档。
光照下的I-V曲线、suns-Voc参数以及summary_IV_performance性能汇总电子表格均通过Sinton FMT-350测试设备获取。
本数据集的EL图像采用"EL扫描（EL sweeps）"模式采集：针对每一组图像，将采集一系列偏置电流递增的单幅EL图像。该采集方式可用于校准后的EL图像分析，通过组件级图像提取每个电池片的暗态I-V特性。图像采集使用搭载850nm长通滤光片的800万像素制冷硅电荷耦合器件（Charge-Coupled Device, CCD）相机。