Correlating Temperature Change with Heat Conduction Process via Mid-Infrared Photothermal Method

This dataset contains experimental and analytical data obtained from a mid-infrared (MIR) photothermal spectroscopic system constructed on the basis of atomic force microscopy (AFM). The data were generated to study the correlation between temperature change and the heat conduction process in polystyrene microspheres (PSMS) and PSMS–WS₂–Au heterojunctions.We developed an MIR photothermal spectroscopic setup using an AFM platform. A mid-IR laser served as the pump source, while a visible probe laser monitored the induced volume expansion of PSMS caused by vibrational relaxation. This configuration enabled the acquisition of high-precision IR absorption spectra.An integrated Raman spectrometer was employed to calibrate the linear dependence between PSMS particle temperature and IR pump power at its absorption energy. The results confirmed a linear relationship between the temperature of PSMS and the far-field pump intensity.Further, through AFM tip manipulation, PSMS–WS₂–Au thermal heterojunctions were fabricated. The data include measurements of thermal conductivity variations across WS₂ layers (1–5 layers), which demonstrate enhanced phonon coupling effects and validate the feasibility of on-chip thermal conduction analysis via MIR photothermal techniques.This version of the dataset contains all the original measured data, including photothermal and Raman signals. The filenames within the dataset indicate the corresponding experimental conditions, such as excitation wavelength, laser power, and other relevant parameters.

本数据集包含基于原子力显微镜（Atomic Force Microscopy, AFM）搭建的中红外（mid-infrared, MIR）光热光谱系统所获取的实验与分析数据，旨在研究聚苯乙烯微球（polystyrene microspheres, PSMS）与PSMS–二硫化钨（WS₂）–金（Au）异质结内的温度变化与热传导过程的相关性。我们基于AFM平台搭建了一套MIR光热光谱实验装置：以中红外激光作为泵浦源，可见光探测激光监测由振动弛豫引发的PSMS体积膨胀效应，该配置可实现高精度红外吸收光谱的采集。我们采用集成拉曼光谱仪，在PSMS的吸收能级处校准了微球温度与红外泵浦功率之间的线性依赖关系，实验结果证实PSMS温度与远场泵浦强度呈线性相关。此外，通过AFM针尖操控工艺，我们制备了PSMS–WS₂–Au热异质结；数据集包含1至5层WS₂的热导率变化测量数据，这些数据揭示了声子耦合效应的增强现象，并验证了利用MIR光热技术开展芯片内热传导分析的可行性。本版本数据集包含全部原始实测数据，涵盖光热信号与拉曼信号，数据集内的文件名标注了对应的实验条件，包括激发波长、激光功率及其他相关参数。