Facile preparation of high conductive silver electrodes by dip-coating followed by quick sintering

With polyol-synthesized silver nanoparticles (AgNPs) as raw materials, the silver electrodes with high conductivity were fabricated via dip-coating method followed by sintering process, and the effects of dip-coating and sintering process on the conductivity and surface roughness of silver electrodes were investigated in detail. The silver film with a thickness of 1.97 μm and a roughness of about 2 nm can be prepared after dip-coated at a pulling rate of 500 μm·s-1 for 40 coating times. The non-conductive dip-coated silver films are transformed into conductive silver electrodes after conventional sintering in muffle oven, infrared sintering and microwave sintering, respectively. Compared with high sintering temperature and long sintering time of conventional sintering and infrared sintering, microwave sintering can achieve the quick sintering of silver films to fabricate high conductive silver electrodes. The silver electrodes with a sheet resistance of 0.75 Ω·sq-1 and a surface roughness of less than 1 nm can be obtained after microwave-sintered at 500 W for 50 s. The adjustable dip-coating method followed by quick microware sintering is an appropriate approach to prepare high conductive AgNPs based electrodes for organic light-emitting diode (OLED) or other devices.

以多元醇合成法制备的银纳米颗粒（AgNPs）为原料，通过浸涂工艺结合烧结流程制备高导电银电极，并详细研究了浸涂与烧结工艺对银电极导电性及表面粗糙度的影响。当提拉速率为500 μm·s⁻¹、浸涂次数为40次时，可制备得到厚度为1.97 μm、表面粗糙度约为2 nm的银薄膜。未经烧结的浸涂银薄膜经马弗炉常规烧结、红外烧结及微波烧结处理后，均可转变为导电银电极。相较于常规烧结与红外烧结所需的高烧结温度与长烧结时长，微波烧结可实现银薄膜的快速烧结，进而制备得到高导电银电极。在500 W功率下微波烧结50 s后，可获得方阻为0.75 Ω·sq⁻¹、表面粗糙度小于1 nm的银电极。参数可调的浸涂工艺结合快速微波烧结，是制备适用于有机发光二极管（organic light-emitting diode，OLED）或其他器件的高导电银纳米颗粒基电极的合适方案。