Supplement TABLE S1, Supplement FIG S1, Supplement FIG S2, Supplement FIG S3, Supplement FIG S4, Supplement Moive S1.,,

Name: Supplement TABLE S1, Supplement FIG S1, Supplement FIG S2, Supplement FIG S3, Supplement FIG S4, Supplement Moive S1.,,
Creator: AIP Publishing
Published: 2024-10-17 12:01:34
License: 暂无描述

DataCite Commons2024-10-17 更新2025-01-04 收录

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https://aip.figshare.com/articles/dataset/Supplement_TABLE_S1_Supplement_FIG_S1_Supplement_FIG_S2_Supplement_FIG_S3_Supplement_FIG_S4_Supplement_Moive_S1_/27194916/1

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TABLE S1. Parameters used in coupled numerical analysis. FIG. S1. The finite element model of the DMCs. FIG. S2. Correlation between the EWOD force and the dielectric layer permittivity. FIG. S3. Correlation between EWOD force and the dielectric layer thickness (frequency = 102 Hz). FIG. S4. Simulation result. Movie S1: Droplet and particle driving experiments in digital microfluidic chips.

补充表S1：耦合数值分析所用参数补充图S1：数字微流控芯片（Digital Microfluidic Chips，DMCs）的有限元模型补充图S2：介质上电润湿（Electrowetting on Dielectric，EWOD）力与介电层介电常数的相关性补充图S3：EWOD力与介电层厚度的相关性（频率=102 Hz）补充图S4：仿真结果补充视频S1：数字微流控芯片内的液滴与颗粒驱动实验

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AIP Publishing

创建时间：

2024-10-17