多元拓扑结构及高密度阵列热电块体器件的设计与微纳集成数据集

本数据集对应课题四研究内容（2），聚焦于多模块、多元化热电块体器件的研发，重点突破了热电块体器件在低温区热电转换效率低、功率密度低等核心技术瓶颈。该数据集服务于高效热电块体器件设计与微纳集成应用需求，涵盖了串并联组装、高效协同调控发电技术、微纳加工与集成工艺、多模块封装与致密化技术，以及器件的稳定性实验与表征技术等关键内容。数据的获取依托多种先进仪器设备，包括RDX-6100型X射线衍射仪、Inspect F50型扫描电子显微镜、HF5000型透射电子显微镜、CTApro型塞贝克及电阻率测试仪、NETZSCH LFA-467型激光热导仪、LakeShore-8404型霍尔系数测试系统和TEGS-1000型热电效率测试系统等。记录的观测值覆盖材料结构、成分、电导率、Seebeck系数、热导率、热电优值zT，以及块体器件的输出电压、输出功率、热流量和能量转换效率等。数据总量约为61.8MB，内容包括实验研究数据、图表合集、支撑数据、第三方测试报告、SCI论文及专利授权文件。数据按热电块体器件与系统的内容分类整理，结构清晰、用途明确，具有重要的科研价值和产业化应用潜力。该数据集的建立将为高效热电器件的设计优化和工业推广提供坚实的支撑，同时助力推动相关领域的技术进步与应用落地。

This dataset corresponds to Research Content (2) of Topic 4, focusing on the development of multi-module and diversified thermoelectric bulk devices, and has made breakthroughs in core technical bottlenecks such as low thermoelectric conversion efficiency and low power density of thermoelectric bulk devices in the low-temperature region. It serves the demands for efficient thermoelectric bulk device design and micro-nano integration applications, covering key contents including series-parallel assembly, efficient collaborative regulation power generation technology, micro-nano processing and integration processes, multi-module packaging and densification technology, as well as device stability experiments and characterization technologies. The data acquisition relies on a variety of advanced instruments and equipment, including RDX-6100 X-ray diffractometer, Inspect F50 scanning electron microscope, HF5000 transmission electron microscope, CTApro Seebeck coefficient and resistivity tester, NETZSCH LFA-467 laser thermal conductivity analyzer, LakeShore-8404 Hall coefficient measurement system, and TEGS-1000 thermoelectric efficiency testing system, among others. The recorded observation values cover material structure, composition, electrical conductivity, Seebeck coefficient, thermal conductivity, thermoelectric figure of merit zT, as well as output voltage, output power, heat flux, and energy conversion efficiency of bulk devices. The total data volume is approximately 61.8 MB, and the content includes experimental research data, chart collections, supporting data, third-party test reports, SCI papers, and patent authorization documents. The data are classified and organized according to the contents of thermoelectric bulk devices and systems, with clear structure and definite purposes, possessing important scientific research value and industrial application potential. The establishment of this dataset will provide solid support for the design optimization and industrial promotion of high-efficiency thermoelectric devices, and also facilitate technological progress and practical application in related fields.

搜集汇总

背景与挑战

背景概述

该数据集聚焦于多元拓扑结构及高密度阵列热电块体器件的设计与微纳集成，旨在突破低温区热电转换效率和功率密度等核心技术瓶颈。它涵盖了串并联组装、微纳加工与集成工艺、器件稳定性实验等关键内容，包含实验数据、图表和测试报告等约61.8MB的数据，为高效热电器件的优化与工业应用提供支撑。