基于130nmSiGeBiCMOS工艺的220GHz功率放大器芯片

该数据集为验证功率放大器输出功率不低于12dBm@220GHz，相对带宽不低于15%@220GHz的佐证材料。数据量为18.3MB，内内含6个文件夹，分别为：“测试PCB”，“大信号测试数据”，“电路版图与检查结果”，“电路原理图与大信号仿真结果”，“电路原理图与小信号仿真结果”和“小信号测试数据”。文件夹“电路版图与检查结果”是片上功率放大器芯片设计完成文件佐证材料，然后进行大信号和小信号仿真验证，佐证文件分别在“电路原理图与大信号仿真结果”和“电路原理图与小信号仿真结果”中。实际测试所需的PCB文件材料在“测试PCB”中，功放芯片大信号和小信号的测试佐证材料在“大信号测试数据”和“小信号测试数据”文件夹中。数据生成地点为清华大学，采集时间为2025年1月15号。This dataset is supporting documentation for verifying that the output power of the power amplifier is no less than 12 dBm@220GHz and the relative bandwidth is no less than 15%@220GHz. It has a total size of 18.3 MB and contains 6 folders, namely: "Test PCB", "Large-signal Test Data", "Circuit Layout and Inspection Results", "Circuit Schematic and Large-signal Simulation Results", "Circuit Schematic and Small-signal Simulation Results", and "Small-signal Test Data". The folder "Circuit Layout and Inspection Results" serves as supporting documentation for the completed design files of the on-chip power amplifier chip. Subsequent large-signal and small-signal simulation verifications are conducted, with their supporting documents stored in "Circuit Schematic and Large-signal Simulation Results" and "Circuit Schematic and Small-signal Simulation Results" respectively. The PCB file materials required for actual testing are contained in the "Test PCB" folder, while the test supporting materials for the large-signal and small-signal performance of the power amplifier chip are located in the "Large-signal Test Data" and "Small-signal Test Data" folders. This dataset was generated at Tsinghua University, and the data collection date is January 15, 2025.

搜集汇总

背景与挑战

背景概述

该数据集提供了基于130nm SiGe BiCMOS工艺的220GHz功率放大器芯片的验证材料，旨在证明其输出功率不低于12dBm且相对带宽不低于15%。数据包含测试PCB、仿真结果和测试数据等6个文件夹，总计18.3MB，由清华大学于2025年1月15日生成。