Data from: An Integrated Liquid Cooling System Based on Galinstan Liquid Metal Droplets

Attached file provides supplementary data for linked article.

The continued miniaturization of electronic components demands integrated liquid cooling systems with minimized external connections and fabrication costs that can be implanted very close to localized hot spots. This might be challenging for existing liquid cooling systems because most of them rely on external pumps, connecting tubes, and microfabricated heat sinks. Here, we demonstrate an integrated liquid cooling system by utilizing a small droplet of liquid metal Galinstan, which is placed over the hot spot. Energizing the liquid metal droplet with a square wave signal creates a surface tension gradient across the droplet, which induces Marangoni flow over the surface of droplet. This produces a high flow rate of coolant medium through the cooling channel, enabling a "soft" pump. At the same time, the high thermal conductivity of liquid metal extends the heat transfer surface and facilitates the dissipation of heat, enabling a "soft" heat sink. This facilitates the rapid cooling of localized hot spots, as demonstrated in our experiments. Our technology facilitates customized liquid cooling systems with simple fabrication and assembling processes, with no moving parts that can achieve high flow rates with low power consumption.

本附件文件为关联文章提供补充数据集。

电子元器件的持续微型化，亟需集成式液体冷却系统——此类系统需尽可能减少外部连接环节与制造成本，且可紧贴局部热点布设。但现有多数液体冷却系统依赖外置泵体、连接管路与微加工散热片，实现此类系统颇具挑战。本研究中，我们利用置于热点上方的少量液态金属镓铟锡（Galinstan），研制出一款集成式液体冷却系统：通过方波信号驱动该液态金属液滴，可在液滴表面产生表面张力梯度，进而引发液滴表面的马兰戈尼（Marangoni）流动。这可使冷却介质在冷却通道内形成高速流动，从而构成“软泵”结构。与此同时，液态金属的高热导率可扩大换热面积，强化热量耗散，进而实现“软散热片”功能。如本团队实验所示，该系统可实现局部热点的快速冷却。本技术可实现定制化液体冷却系统的制造，其制备与组装流程简便，无运动部件，且可在低功耗下实现高流速冷却。

搜集汇总

背景与挑战

背景概述

该数据集为2018年RMIT University发布的关联研究文章的补充数据，聚焦于一种基于Galinstan液态金属液滴的集成液体冷却系统。系统利用液滴作为软泵和软散热器，通过Marangoni效应实现高效冷却，具有无移动部件、低功耗和简单制造的特点，旨在解决电子元件微型化中的散热问题。