该数据集是本项目设计的SoC整体的显微镜照片，以及SoC后端产生的GDS版图文件。其中照片即为代号为Trainerpro的SoC芯片回片之后对其开盖拍摄的显微镜照片；GDS版图数据文件即为芯片设计最后流程中产生的交付代工厂的GDSII（Graphical Data System II）格式的版图文件，内部为二进制格式，存储了芯片布局和电路设计信息，包含所有层，元件和封装的信息。
Report of Wafer Inspection and Metrology Systems for Advanced Packaging Market is covering the summarized study of several factors encouraging the growth of the market such as market size, market type
Raw data for the paper "Modified Levey-Jennings Chart with Robust Estimator: A Case of Semiconductor Manufacturing Process". Dataset and stastical analysis data.
Report of CMP Slurry for STI & ILD Market is covering the summarized study of several factors encouraging the growth of the market such as market size, market type, major regions and end user applicat
