高效率小尺寸大带宽垂直层间波导耦合器模拟数据

一种介于两层硅层之间的垂直层间耦合器，主要面向光通信领域研究，基于Lumerical软件仿真，主要记录了损耗等参数，数据量1.77MB。自三维光子集成电路出现以来，实现高效、紧凑的层间光学互连已成为一个重要的发展方向。本文提出了一种介于两层硅层之间的垂直层间耦合器。分析了定向耦合器的耦合原理，改进了传统的使用一对垂直重叠倒锥结构的方法。对于两个矩形波导层的耦合，演示了一对沿传输方向偏移的非线性锥形。对于两个脊波导层的耦合，在每一层中使用非线性锥形来实现高耦合效率。模拟结果表明，在1500nm至1650nm的波长范围内，两种结构的耦合效率可以达到90%以上。此外，串扰降低到小于?通过在交叉点处使用多模波导来获得50dB。具有非线性锥度的垂直层间耦合器有望实现光子的小型化和密集集成集成芯片。

A vertical inter-layer coupler sandwiched between two silicon layers, primarily targeted for optical communication-related research, is simulated via Lumerical software. This dataset mainly records parameters such as coupling loss, with a total size of 1.77 MB.

Since the advent of three-dimensional photonic integrated circuits (3D PICs), achieving efficient and compact inter-layer optical interconnection has emerged as a crucial research direction. This work proposes a vertical inter-layer coupler between two silicon layers. The coupling principle of directional couplers is analyzed, and the conventional method using a pair of vertically overlapping inverted tapered structures is optimized. For the coupling between two rectangular waveguide layers, a pair of nonlinear tapers offset along the propagation direction is demonstrated. For the coupling between two ridge waveguide layers, nonlinear tapers are employed in each layer to achieve high coupling efficiency. Simulation results demonstrate that within the wavelength range of 1500 nm to 1650 nm, the coupling efficiency of both structures can exceed 90%. Additionally, by adopting multimode waveguides at the crossing points, the crosstalk is reduced to below 50 dB. The vertical inter-layer coupler with nonlinear tapers shows great potential for enabling the miniaturization and dense integration of photonic integrated chips.

搜集汇总

背景与挑战

背景概述

该数据集包含高效率小尺寸大带宽垂直层间波导耦合器的模拟数据，基于Lumerical软件仿真，主要记录了损耗等参数，数据量1.77MB。模拟结果表明，在1500nm至1650nm的波长范围内，两种结构的耦合效率可以达到90%以上，串扰降低到小于50dB。