A novel multi-scale thermal contact resistance model for IGCTs
收藏IEEE2026-04-17 收录
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资源简介：
Based on the measured surface parameters and others, combined with the proposed novel multi-scale TCR model, the junction-to-case thermal resistance of existing IGCT devices is calculated. At the same time, the results obtained using the CMY model are compared with those of the proposed model.
提供机构：
Yanzhong Tian
