DML芯片的3dB带宽数据

面向5G前传接入应用场景，研制50G PAM4 DML芯片需要验证DML芯片在工业温度范围下带宽性能。在-40℃~＋85℃温度范围内，测试50G DML芯片的频率响应下降3dB（50%）时的截止频率，即3dB带宽数据。数据采集方式为：在温度(23±3)℃，湿度(55±5)%RH的洁净实验室环境下，使用网络分析仪进行扫频分析，绘制低温(-40℃)、常温(25℃)、高温(85℃)下DML芯片的幅度-频率响应曲线，响应曲线3dB以内的频率范围即为3dB带宽，数据量为10MB。For the development of 50G PAM4 DML chips targeting 5G fronthaul access application scenarios, it is necessary to verify the bandwidth performance of DML chips within the industrial temperature range. Specifically, the cutoff frequency at which the frequency response of the 50G DML chip drops by 3 dB (50%) within the temperature range of -40°C to +85°C is tested, which constitutes the 3dB bandwidth dataset. The data collection process is as follows: in a clean laboratory environment with a temperature of (23±3)°C and relative humidity of (55±5)%RH, a network analyzer is used for swept-frequency analysis to plot the amplitude-frequency response curves of the DML chip at low temperature (-40°C), room temperature (25°C) and high temperature (85°C). The frequency range within 3 dB of the response curve is defined as the 3dB bandwidth, and the total data volume is 10 MB.

搜集汇总

背景与挑战

背景概述

该数据集面向5G前传接入应用，提供了50G PAM4 DML芯片在工业温度范围（-40℃~85℃）下的3dB带宽性能测试数据。数据通过网络分析仪在洁净实验室环境中采集，包括低温、常温和高温下的幅度-频率响应曲线，以评估芯片的带宽特性。