遇见数据集

Reverse design of the MIM-enhanced EBG structure

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IEEE2026-04-17 收录
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This dataset is part of a study on the optimization of electromagnetic bandgap (EBG) structures for system-in-package (SiP) applications. It focuses on the integration of Metal-Insulator-Metal (MIM) capacitors into the EBG unit cell, to suppress electromagnetic interference (EMI) over a wider frequency band. The dataset includes parameterized designs with 6 variables and their corresponding performance metrics such as stopband frequency and bandwidth.

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