Data for Controlling the Reaction Pathway to Tune Packaging Epoxy Properties
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This repository contains data from multiple modalities used to study the effect of reaction conditions on the cure of a thermosetting epoxy. The material is a model thermoset system (TM01) of bisphenol F diglycidyl ether (DGEBF) epoxy resin and diethyl toluene diamine (DETDA) curing agent mixed in a stoichiometric ratio.
