The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures
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The data released here is for the paper "The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures". DOI: : 10.1007/s11664-020-08697-4 Tianhong Gu1*, Christopher M. Gourlay1, and T. Ben Britton1 Department of Materials, Imperial College London, SW7 2AZ. UK *Corresponding author: t.gu15@imperial.ac.uk, +44 20 7594 2634 *.bcf = Bruker BCF data for full EBSD map to plot EBSD maps *xlsx. = spreadsheet of graphical data for plots in Fig2 and Fig 4 (creep curves) *.tif = images used to to build up Figures (the figures are presented in the powerpoint) The data bundle was prepared by Tianhong Gu
创建时间：
2021-01-11
