Bivariate Cut-HDMR and CCD sample points

These data are the warpage values of a TFBGA package determined by a finite element model. The data includes the input values at the sample points and response (warpage).本数据集为通过有限元模型（Finite Element Model）计算得到的TFBGA封装翘曲值数据集，其中包含采样点处的输入参数与翘曲响应值。