IEEE Electronics Packaging Society TC-EDMS Benchmark: Problem 2 - Plasma Package

The Packaging Benchmark Suite by IEEE Electronics Packaging Society (EPS) Technical Committee on Electrical Design, Modeling and Simulation (TC-EDMS) aims to provide information about electromagnetic, electrical and circuit modeling and simulation problems encountered and the computational methods used when designing, analyzing, and developing electronic packages.This is Benchmark Problem #2 in the suite.