工业芯片可靠性评价平台计量与质量标准化技术研究数据集

芯片失效分析是芯片可靠性评价的关键步骤之一，在工业芯片失效机理分析过程中，分析失效机理的准确度受限于失效点分析手段的精准度。然而现有的可靠性检测平台缺少对精密分析仪器的校准技术。同时，由于应用场景的差异和国外技术标准保密等情况，在标准方面国内无法直接照搬使用国外标准，导致标准及标准体系缺失，无法发挥对国产工业芯片的标准规范引领和质量提升作用。本课题针对课题2建立的工业芯片可靠性检测平台，研究其纳米级检测分析仪器计量校准技术，通过研制纳米几何结构系列标准器和金属单元素标准器，研究聚焦离子束双束系统（FIB）与 X 射线能谱仪的计量校准方法；建立以国家标准为指导、行业标准为应用基础、团体标准为产品规范的标准体系，实现计量与标准技术的全面共享，保障工业芯片质量。Chip failure analysis is one of the key steps in chip reliability evaluation. During the analysis of industrial chip failure mechanisms, the accuracy of failure mechanism analysis is limited by the precision of failure point analysis methods. However, current reliability testing platforms lack calibration technologies for precision analytical instruments. Meanwhile, due to differences in application scenarios and the confidentiality of foreign technical standards, domestic industries cannot directly adopt foreign standards, resulting in the absence of standards and standard systems, and failing to play a guiding role in standard specification and quality improvement for domestic industrial chips. This study targets the industrial chip reliability testing platform established in Project 2, and focuses on the metrological calibration technology for its nano-scale detection and analytical instruments. By developing a series of standard specimens for nano-scale geometric structures and single-element metal standard specimens, we will study the metrological calibration methods for focused ion beam dual-beam systems (FIB) and X-ray energy dispersive spectrometers. We will also establish a standard system guided by national standards, based on industrial standards, and with group standards as product specifications, to achieve full sharing of metrological and standard technologies and ensure the quality of industrial chips.

搜集汇总

背景与挑战

背景概述

该数据集聚焦于工业芯片可靠性评价平台，针对现有平台在纳米级检测分析仪器校准技术方面的不足以及国内标准体系缺失的问题，开展计量与质量标准化技术研究。通过研制标准器并建立以国家标准为指导的标准体系，旨在提升国产工业芯片的可靠性评价准确性和质量规范。