层间耦合器模拟数据

模斑转换器及其制备方法模拟数据主要面向硅基多层三维光交叉连接芯片架构及机理研究，基于硅基层间耦合结构的模斑转换器的仿真设计，主要记录了损耗等模拟数值，数据量1.7MB。The simulation dataset for mode spot converters and their preparation methods is primarily targeted at research on the architecture and mechanism of silicon-based multi-layer 3D optical cross-connect chips. Derived from the simulation design of mode spot converters based on silicon-based inter-layer coupling structures, this dataset mainly records simulated values including optical losses, with a data size of 1.7 MB.

搜集汇总

背景与挑战

背景概述

该数据集提供了面向硅基多层三维光交叉连接芯片研究的模斑转换器仿真设计数据，主要记录了层间耦合结构的损耗等模拟数值。数据包含3个文件，总计约1.7MB。